Kinetics of Cu underpotential deposition on iodine-modified Au(111) electrodes

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Show simple item record Martínez-Ruiz, A Palomar-Pardave, M Valenzuela-Benavides, J Farias, MH Batina, N 2011-01-22T10:26:44Z 2011-01-22T10:26:44Z 2003
dc.identifier.issn 1520-6106
dc.description.abstract The kinetics of copper underpotential deposition (UPD) on Au(I 11) previously covered with an iodine adlayer were investigated by means of cyclic voltammetry (CV) and chronoamperometry (CA) techniques in an aqueous solution containing I MM CuSO4 and 0.05 M H2SO4. Characterization of the deposition process was based on quantitative analysis of the potentiostatic current-time curves recorded during Cu UPD. It was found that the deposition behavior can be well described by a model that involves three types of contributions: (i) a Langmuir-type adsorption process with two different kinds of two-dimensional nucleation mechanisms, (ii) an instantaneous, and (iii) a progressive contribution, the latter two limited by lattice incorporation of adatoms. It is shown that the main effect of the iodine adlayer is to slow the kinetics of Cu UPD when compared to the same process in the absence of an iodine adlayer. Results from CV also reveal a very stable iodine adlayer even after several Cu deposition/stripping cycles, requiring a high positive potential when surface oxidation takes place in order remove it from the Au(I 11). en_US
dc.language.iso en en_US
dc.title Kinetics of Cu underpotential deposition on iodine-modified Au(111) electrodes en_US
dc.type Article en_US
dc.identifier.idprometeo 1936
dc.identifier.doi 10.1021/jp027197x
dc.source.novolpages 107(42):11660-11665
dc.subject.wos Chemistry, Physical
dc.description.index WoS: SCI, SSCI o AHCI
dc.relation.journal Journal of Physical Chemistry B

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